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Electrolytic copper plating is a plating applied as the second layer of multilayer plating systems (Ni + Cu + Ni + Cr) and sometimes with varnish for decorative purposes. Contains Copper Sulphate (CuSO4 • 5H2O) and Sulfuric acid (H2SO4). In addition, a brightener is added for a glossy plating. Room temperature is sufficient for the bathroom to work. Cathode or air movement required. Filtration is essential. A special phosphorus-containing anode should be used as the anode.